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Leak Specifications Snapdragon 670, 640, and 460 Chipset Has Appeared

Qualcomm is now arguably the king of chipsets because the company from the United States has many mobile platforms that reach all categories. While in the middle class segment, they have a lot of platforms, even some are so far not yet carried by any smartphone like Snapdragon 636.
 
Now the new year 2018 will arrive soon and the company has set up its new chipset and leaked details about Qualcomm's latest chipset has been in circulation. Details this time revealed three mid-range chipset, the Snapdragon 670, Snapdragon 640, and Snapdragon 460 which will be carried by medium-sized smartphone in 2018.
This chipset will be a middle-class chipset of the company that is in the highest position, that is as a replacement for Snapdragon 660. Leak of the existence of this chipset before it had appeared several months ago. The chipset is built with a 10nm manufacturing process that features an octa-core processor (quad-core Kryo 360 Core Gold Cortex-A75 2.0GHz + quad-core Kryo 385 Cortex-A55 1.60GHz Core). As for graphics processing, the chipset relies on the Adreno 620 GPU and will have a Spectra 260 ISP that supports a single sensor of up to 26MP and a 13MP dual sensor. LTE speed also gets improved with a new X16 modem that replaces X12 modem on Snapdragon 660. Maximum download speed is 1000Mbps and upload speed up to 150Mbps maximum.

Snapdragon 640 

This chipset is also still built with a 10nm process and rely on an octa-core processor that consists of dual-core Kryo 360 Gold 2.15GHz and hexa-core Kryo 360 Silver 1.55GHz. As for the graphics processor using the Adreno 610 GPU and will have an ISP like Snapdragon 670 but with the same X12 modem as Snapdragon 636. 
Snapdragon 460 Snapdragon 

460 will replace the Snapdragon 450 which is currently only available on some devices like Vivo V7 and V7 + and Xiaomi Redmi 5 The chipset is built with a 14nm processor that features an octa-core processor comprising quad-core Kryo 360 Silver 1.8GHz and quad-core Kryo 360 Silver 1.4GHz and Adreno 605 GPU and ISP Spectra 605. In addition, the chipset will also carry LTE X12 models like Snapdragon 640. 

Chipset ini akan menjadi chipset kelas menengah dari perusahaan yang berada di posisi tertinggi, yakni sebagai pengganti Snapdragon 660. Bocoran mengenai keberadaan chipset ini sebelumnya memang sudah sempat muncul beberapa bulan yang lalu. Chipset ini dibangun dengan proses manufaktur 10nm yang memiliki prosesor octa-core (quad-core Kryo 360 Core Gold Cortex-A75 2.0GHz + quad-core Kryo 385 Core Cortex-A55 1.60GHz). Sedangkan untuk mengolah grafis, chipset ini mengandalkan GPU Adreno 620 dan akan memiliki ISP Spectra 260 yang mendukung sensor tunggal hingga 26MP dan sensor ganda 13MP. Kecepatan LTE juga mendapat peningkatan dengan modem X16 baru yang menggantikan modem X12 pada Snapdragon 660. Kecepatan download maksimal adalah 1000Mbps dan kecepatan upload maksimal hingga 150Mbps.

Selengkapnya: https://www.beritateknologi.com/bocoran-spesifikasi-chipset-snapdragon-670-640-dan-460-telah-muncul/
 
Qualcomm is now arguably the king of chipsets because the company from the United States has many mobile platforms that reach all categories. While in the middle class segment, they have a lot of platforms, even some are so far not yet carried by any smartphone like Snapdragon 636.
 
Now the new year 2018 will arrive soon and the company has set up its new chipset and leaked details about Qualcomm's latest chipset has been in circulation. Details this time revealed three mid-range chipset, the Snapdragon 670, Snapdragon 640, and Snapdragon 460 which will be carried by medium-sized smartphone in 2018.
This chipset will be a middle-class chipset of the company that is in the highest position, that is as a replacement for Snapdragon 660. Leak of the existence of this chipset before it had appeared several months ago. The chipset is built with a 10nm manufacturing process that features an octa-core processor (quad-core Kryo 360 Core Gold Cortex-A75 2.0GHz + quad-core Kryo 385 Cortex-A55 1.60GHz Core). As for graphics processing, the chipset relies on the Adreno 620 GPU and will have a Spectra 260 ISP that supports a single sensor of up to 26MP and a 13MP dual sensor. LTE speed also gets improved with a new X16 modem that replaces X12 modem on Snapdragon 660. Maximum download speed is 1000Mbps and upload speed up to 150Mbps maximum.

Snapdragon 640 

This chipset is also still built with a 10nm process and rely on an octa-core processor that consists of dual-core Kryo 360 Gold 2.15GHz and hexa-core Kryo 360 Silver 1.55GHz. As for the graphics processor using the Adreno 610 GPU and will have an ISP like Snapdragon 670 but with the same X12 modem as Snapdragon 636. 
Snapdragon 460 Snapdragon 

460 will replace the Snapdragon 450 which is currently only available on some devices like Vivo V7 and V7 + and Xiaomi Redmi 5 The chipset is built with a 14nm processor that features an octa-core processor comprising quad-core Kryo 360 Silver 1.8GHz and quad-core Kryo 360 Silver 1.4GHz and Adreno 605 GPU and ISP Spectra 605. In addition, the chipset will also carry LTE X12 models like Snapdragon 640. 

Chipset ini akan menjadi chipset kelas menengah dari perusahaan yang berada di posisi tertinggi, yakni sebagai pengganti Snapdragon 660. Bocoran mengenai keberadaan chipset ini sebelumnya memang sudah sempat muncul beberapa bulan yang lalu. Chipset ini dibangun dengan proses manufaktur 10nm yang memiliki prosesor octa-core (quad-core Kryo 360 Core Gold Cortex-A75 2.0GHz + quad-core Kryo 385 Core Cortex-A55 1.60GHz). Sedangkan untuk mengolah grafis, chipset ini mengandalkan GPU Adreno 620 dan akan memiliki ISP Spectra 260 yang mendukung sensor tunggal hingga 26MP dan sensor ganda 13MP. Kecepatan LTE juga mendapat peningkatan dengan modem X16 baru yang menggantikan modem X12 pada Snapdragon 660. Kecepatan download maksimal adalah 1000Mbps dan kecepatan upload maksimal hingga 150Mbps.

Selengkapnya: https://www.beritateknologi.com/bocoran-spesifikasi-chipset-snapdragon-670-640-dan-460-telah-muncul/
 

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